An Overview of IPC 4552
This is a specification that defines the requirements for ENIG as a surface finish. Gold and electroless nickel deposit thicknesses based on performance criteria can be determined using the requirements in this specification.
In PCB manufacturing, this specification is applicable in soldering, wire bonding, and press-fit connections.
Challenges Of IPC 4552
The challenge with this specification is the upper limit is placed on the ENIG gold thickness applied for optimum product performance.
This thickness must be monitored and the specification recommends using XRF equipment to test and monitor the thickness.
Many ofย the PCB manufacturers with XRF machines have older versions that might fail to meet the new IPC demands. But this is where Alternate Finishing, Inc. excels.
Work With Us
At Alternate Finishing, Inc., we not only meet the stringent standards of IPC 4552 but we also have the equipment to provide the exceptional service with quick turnaround times.
For more information and help from AFI on meeting your PCB needs while complying with the specification,ย call us for a quote.