Understanding PCB terminology is essential for navigating the complexities of PCB manufacturing. The terminology and key plating processes are the first steps to ensuring quality and reliability in circuit boards. This glossary will define the most common terms used in PCB production and assembly.
Conductivity: The ability of a PCB finish or material to allow the flow of electrical current effectively, a critical factor in circuit performance.
Copper Foil: A conductive layer applied to the substrate of a PCB, serving as the foundation for circuit traces.
Delamination: The separation of PCB layers, typically caused by excessive heat, moisture, or mechanical stress.
ENIG (Electroless Nickel Immersion Gold): A popular finish offering a smooth, corrosion-resistant surface with excellent solderability and bond strength, often used in high-reliability PCBs.
Etching: The process of removing unwanted copper from a PCB, leaving only the desired traces and pads intact.
Flux: A chemical cleaning agent applied during soldering to prevent oxidation and improve the flow of solder.
HASL (Hot Air Solder Leveling): A PCB finish where molten solder is applied to the surface and leveled with hot air, providing good solderability.
Immersion Silver: A finish that deposits a thin layer of silver on copper to enhance solderability and conductivity while providing good surface flatness.
Immersion Tin: A finish where tin is deposited directly onto the copper surface to ensure good solderability, often used in lead-free PCBs.
Lamination: The process of bonding multiple layers of material (substrates, copper, etc.) to form a multi-layer PCB.
OSP (Organic Solderability Preservative): A water-based finish that coats copper pads to prevent oxidation, maintaining solderability without altering surface dimensions.
Pad: The exposed area on a PCB where components are soldered, often requiring precise finishing for reliable connections.
Panelization: The process of grouping multiple PCB designs into a single panel for manufacturing efficiency and easy separation post-production.
Plating: The deposition of a conductive or protective layer (e.g., nickel, gold) on PCB surfaces, typically for enhanced solderability and durability. Also known as metal finishing.
Reflow: A soldering technique used to melt solder paste and secure components to a PCB during assembly.
Silkscreen: The layer of a PCB that provides labeling for components, pads, and other features using ink or printing techniques.
Solder Mask: A protective coating applied over the PCB to prevent solder bridges and protect against contaminants during soldering.
Surface Finish: The coating applied to exposed copper pads to protect them from oxidation and ensure reliable solder connections.
Surface Roughness: The microtexture of a PCB surface, which can impact solderability and adhesion in advanced manufacturing processes.
Via Filling: The process of filling plated-through holes (vias) with conductive or non-conductive material to improve reliability and thermal performance.
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