| Finish | Description | Specifications |
|---|---|---|
| Gold, Soft Gold | Gold for wirebonding and soldering | MIL-DTL-45204 Type I or Type III, Grade Aย ASTM B488-11 Type I or Type III Code Aย AMS 2422ย |
| Gold, Hard Gold | Gold for contacts and soldering | MIL-DTL-45204 Type I or Type II, Grade Cย ASTM B488-11 Type I or Type II, Code Cย AMS 2422ย |
| Electroless Gold | Soft wire bondable electroless Gold | |
| Nickel | Low stress semi bright finish | QQ-N-290 ASTM B689 AMS 2403 AMS 2424 MIL-P-27418 |
| Electroless Nickel | 6% – 8% Phosphorous 8%-12% Phosphporous | Mil-C-26074, ASTM B733, AMS 2404 |
| Electroless Nickel and Immersion Gold | ENIG, a solderable finish for printed circuits and other copper parts | IPC-4552, |
| Immersion Silver | Solderable finish for printed circuits and other copper parts | IPC-4553 |
| Copper | Copper sulfate plating solution | MIL-C-14550 ASTM B734 |
